With the Galaxy S7 and S7 Edge, Samsung started the implementation of heat sinks in the form of high density liquid tubes, to help slow the warming of the new flagships. The solution is found both in the model with Snapdragon 820 as the variant with Exynos 8890. This is not to say that these powerful processors suffer from the same evil Snapdragon 810, but the South Korean just want to make sure that the S7 not fry in your hands in times of more intense use.
Sony has taken a similar approach with the Xperia Z5 series, which came with the SoC esquentadinho infamous Qualcomm. The Japanese manufacturer has implemented dual channels to ensure better dissipation and cause the temperature of the Snapdragon 810 falls rapidly after a moment of past stress the hardware. Unfortunately, not all smartphones released with this chipset brings a concern to the heating by the other manufacturers.
Thinking soften the high heating problem in Nexus 6P, the Gorgtech member of the XDA forum held fast surgery on his phablet Google. As can be seen above, he dismantled the device to make a small change, we are used to seeing in computers, to expand the power of thermal dissipation component:. The use of thermal paste on the processor
process is very laborious. First you must use a dryer to warm the back and soften the glue holding the rear panel. Then you must do the same with the glass that protects the rear camera. After that comes the most delicate moment: remove battery and other connectors (and fragile) to get to the chipset compartment. Now is the time to apply a generous amount of thermal grease and reassemble the Nexus 6P. The result you can see in the image below:
Who has to know all the details, Gorgtech held a tutorial on a dedicated topic in XDA forum. According to him, this change drastically reduces the Snapdragon 810 heating problem in Nexus 6P.
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